|
Temperature
|
Ceramique
(Day 1)
|
Silver
Experimental
|
|
CPU
High
|
134º
|
127º
F
|
|
CPU
Avg
|
125º
|
120º
F
|
|
Case
High
|
96º
|
95º
F
|
|
Case
Avg
|
93º
|
91º
F
|
Results:
Day 3
|
Temperature
|
Ceramique
(Day 3)
|
Silver
Experimental
|
|
CPU
High
|
131º
F
|
127º
F
|
|
CPU
Avg
|
122º
F
|
120º
F
|
|
Case
High
|
95º
F
|
95º
F
|
|
Case
Avg
|
91º
F
|
91º
F
|
Results
Both samples
remove enough heat that over time, the average temps in the case make this
comparison a dead heat. Only when examining the peak and average CPU temps
do we see minimal differences. With the standard Intel retail heatsink fan
cooling and an InWin S-508 enclosure with 1 rear case fan, this P4 2.4B
sample sails through 3DMark2003 at no more than an average of 122F or 50C!
Idle temps are 20F or 11C cooler.
One caveat:
the Ceramique requires significantly more care and time to apply. The Nanotherm
products are of a more typical nature as far as application and removal.
If you don't enjoy spending the time to build and tweak your box for those
extra few hundred 3DMark points, possibly this new ArcticSilver product
isn't for you.
Conclusion
Both products
tested here are of the highest quality and performance tested at TargetPC.
Differences exist but are so minimal that both samples get the nod. Anything
that can cool a heat source dissipating approximately 80 Watts deserves
a serious look and Ceramique joins ArcticSilver's exclusive lineup as another
winner. The 8.5/10 score is for mostly the more finicky application and
that is a sliver less efficient than the Nanotherm product. Recommended.
William
Yaple
05/19/03
